Thermal management is crucial for the performance and longevity of modern electronic devices. However, it’s mostly overlooked and unappreciated by manufacturers and end users, until it becomes a snag, such as overheating or worse, explosion, in a device.
The truth is, as technology advances, new ;releases progressively pack more power, higher heat, into a small case.
Effectively and efficiently managing heat is important to both the user and the manufacturers. It guarantees the safety, comfort, and optimal performance of devices and manufacturers enjoy cost-efficient solutions that seamlessly fits with product design.
In this article, we’ll explore the latest thermal management challenges – focusing on electronic devices – and offer practical solutions for energy-efficient operation.
Overcoming Common Thermal Management Challenges
The following are the latest heat management challenges faced in most industries:
1. Increased Package Power Density
The trend of companies shelling out thinner yet more powerful devices – that we all have hots for – creates a hot mess. In other words, these devices run hotter, the more features they pack, particularly so, when they are used at full throttle.
As power densities rise, so do the temperatures of the devices, making it harder to dissipate heat efficiently.
In recent trends, users of the new iPhone 15 – arguably one of the most powerful smartphones – bitterly complain about an overheating issue. While this is a great example, Apple promised to release a software update and promises it’s not a hardware or thermal management challenge.
2. Thermal Cross-Talk and Isolation
When components are placed close together in a device, heat from one can affect the other, leading to uneven temperatures and potential failures.
In a smartphone, the processor and battery are tightly packed. If the processor heats up during heavy use, it can raise the battery’s temperature, potentially shortening its lifespan. Also, in electric vehicles, when one battery cell short circuits, it can trigger overheating in the next and eventually lead to thermal runaway.
Generally, manufacturers try to keep the battery cell’s temperature in check with a thermal barrier. This can be a heat-friendly and electricity-hostile material, like mica sheets alone or combined with another material, to ensure the device operates smoothly.
3. Diverse Thermal Needs
Tools, machines, or gadgets, especially modern ones, use components with varying thermal requirements and sensitivities. It becomes a challenge to create a holistic thermal management system that effectively meets the needs of all components, depending on the range of temperatures.
In a gaming console, the CPU and GPU generate significant heat and need robust cooling, while the memory chips require less cooling. The eMMC of a Nintendo Switch doesn’t require cooling, but is passively cooled by the backplate, and in the OLED version, from the front.
However, designing a system that guarantees these varying heating and cooling component operates within safe temperature ranges still poses a challenge in industries, particularly in electric vehicles and aeronautics.
4. Thermal Interface Material (TIM) Performance
Thermal Interface Materials (TIMs) are crucial for transferring heat from chips to heat sinks. However, variations in TIM performance can cause problems. Factors like surface flatness and warping impact how well TIMs conduct heat, leading to uneven cooling and potential overheating.
In high-power LEDs, poor TIM performance due to surface irregularities can lead to inefficient heat transfer. This results in hotspots that decrease the LED’s efficiency and lifespan, highlighting the importance for manufacturers to ensure proper TIM application for optimal thermal management.
5. Thermal Management in High Power Devices
High-power devices, such as voltage regulators, generate significant heat even when operating efficiently. Effective thermal management in these compact designs is critical to prevent overheating and ensure reliable operation. When high-power components like these are used, managing the resultant heat in limited spaces becomes challenging.
In data centers, high-performance voltage regulators manage power supply to data servers. Without proper thermal management, these regulators overheat, causing recurring server downtime and potential data loss.
Solutions to Thermal Management Challenges
Here are some innovative solutions you can implement to guarantee a steller thermal management solution in your products.
1. Advanced Cooling Technologies
Implementing advanced cooling technologies can tackle many thermal management challenges effectively. These solutions ensure efficient heat removal and reliable performance.
Some advanced cooling techniques, like embedded liquid cooling, provide efficient heat removal by passing liquid cooling directly into chip designs to target hotspots and maintain uniform temperatures.
This approach, validated in a study on SiC substrates – materials used in semiconductor technology made from silicon carbide –, shows a significant reduction in junction-to-coolant thermal resistance, improving temperature uniformity. The researchers developed an ultra-thermostable embedded liquid cooling strategy in SiC 3D packaging power modules for electric vehicles that demonstrated effective heat dissipation, allowing stable operation up to 320 W at a 100 mL/min coolant flow rate, compared to 144 W for traditional setups.
2. Thermal Interface Materials (TIM) Improvements
Improving Thermal Interface Materials (TIMs) is pivotal for boosting heat transfer efficiency. TIMs are designed to fill microscopic air gaps between surfaces, which significantly enhances thermal conductivity across interfaces.
Advanced TIMs, made from materials with higher thermal conductivities and lower thermal resistances, can dramatically improve heat dissipation. For instance, mica sheets can be attached to heat sinks as insulators, providing extra heat dissipation, plus dielectric capacity.
3. System-Level Thermal Design
Incorporating thermal management into the overall system design from the start ensures better thermal performance and efficiency. This involves designing systems that adapt to varying heat loads and environmental conditions seamlessly.
System-level thermal design means considering thermal management as an integral part of the device’s architecture, not an afterthought. For example, in high-performance servers, integrating thermal management into the initial design phase allows for optimized airflow, strategic placement of heat-generating components, and enhanced cooling solutions. This proactive approach leads to stable operation and reduced risk of overheating under varying workloads, as highlighted in detailed studies on effective thermal system designs.
4. Thermal-Mechanical Co-Design
Thermal-mechanical co-design integrates thermal and mechanical considerations into the design process, addressing issues like thermal expansion and warpage, which can affect performance and reliability.
This holistic approach ensures that all aspects of the device work together harmoniously. For instance, in high-performance electronic devices, integrating thermal and mechanical designs minimizes stress and distortion caused by temperature fluctuations. This leads to more robust thermal management solutions that ensure improved device lifespan and stability.
5. Microchannels for High-Performance Cooling
Implementing microchannels in high-performance devices significantly enhances cooling efficiency. These tiny channels allow for direct liquid cooling, which is far more effective than traditional air cooling methods.
Microchannels are precisely engineered to guide coolant directly over heat-generating components, quickly dispersing heat and maintaining optimal temperatures. For example, in advanced ASICs, microchannels integrated into the silicon substrate can drastically improve cooling performance. This technique ensures that even the most heat-intensive tasks do not lead to overheating, maintaining device reliability and performance. Research shows that microchannel cooling can reduce operating temperatures and extend the lifespan of high-performance electronic devices.
Thermal Management in Harsh Environments
For applications in harsh environments such as military or aerospace, robust thermal management solutions that can withstand extreme conditions are necessary. This includes the use of durable materials and innovative cooling techniques.
Effective thermal management is key to maintaining the performance, reliability, and safety of modern electronic devices. As devices become more powerful and compact, choosing the right thermal management solution becomes increasingly crucial.
Due to these, it’s important for manufacturers to understand the challenges their thermal management system may encounter beforehand and how to solve them.
Ideally, you should understand your device’s thermal requirements, evaluate various cooling options, and integrate thermal management into your design plans from the outset.
Moreover, you should consider advanced solutions such as microchannels and improved thermal interface materials for efficient heat dissipation, especially for high-performance applications like a modem or data center.
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